Innosilicon has advanced system level packaging (SiP) assembly technology and testing methods, and has established a mature SiP ecosystem. By adopting Innosilicon SiP service, customers will receive products with smaller dimensions, better electrical performance, lower power consumption, faster time to market, and cost competitiveness.
Advanced Package Solutions
Innosilicon has advanced system level packaging (SiP) assembly technology and testing methods, and has established a mature SiP ecosystem. By adopting Innosilicon SiP service, customers will receive products with smaller dimensions, better electrical performance, lower power consumption, faster time to market, and cost competitiveness.
Package Solution Category
Case Diagram
Traditional and Advanced Packaging
Advanced Exposed Die Packaging
Advanced Package Solution Category-TSV and 2.5D/3D Packaging