Advanced Package Solution Category-TSV and 2.5D/3D Packaging
High Density Organic Substrate Design
Area: 60*60mm2
Layers: 16+
Warpage Simulation Example
Package Solution Category
Case Diagram
Advanced Package Solutions
Innosilicon has advanced system level packaging (SiP) assembly technology and testing methods, and has established a mature SiP ecosystem. By adopting Innosilicon SiP service, customers will receive products with smaller dimensions, better electrical performance, lower power consumption, faster time to market, and cost competitiveness.
Advanced Package Solutions
Innosilicon has advanced system level packaging (SiP) assembly technology and testing methods, and has established a mature SiP ecosystem. By adopting Innosilicon SiP service, customers will receive products with smaller dimensions, better electrical performance, lower power consumption, faster time to market, and cost competitiveness.