Backed by more than 14 years of technology expertise, Innosilicon has extended its support to all high-speed mixed signal IP cores on 130nm to 5nm processes to address large and fast-growing markets such as data centers, public/private cloud servers, automotive, 5G communications, industrial and IoT.
We will provide you with production- and silicon-proven IP products allowing for customization to perfectly meet your very unique demands
A variety of comprehensive PHY & Controller solutions and Combo fitting various application scenarios, with high-reliability / high-performance / high-security / scalable design, fully supporting all mainstream FinFET processes.
Worry-free integration, power and I/O optimization for small silicon area, PPA customization to perfectly meet customer’s application scenarios, fast one-stop integration with optimal area, power consumption and packaging.
One-stop PHY & Controller package and a full set of PCB and SI/PI, supporting full-custom hard macro and SI packaging solution including process/chip/package/PCB all-around optimization, within a short customization cycle of 2 to 3 months.
Best-fit service for the customers, supporting various FPGA integration, SoC integration and specialized mass production, with a full custom solution of cross-design, cross-process and cross-package.