About Us

Innosilicon - High Speed IP & Design Services Leader

Innosilicon, a leading provider of IP and SoC services with over 18 years of experience, specializes in computing, storage, and connectivity. We offer a comprehensive portfolio of high-speed interface IP, cutting-edge SoC platform architectures, and customizable processor cores across a range of process nodes, from 55nm to 3nm, in collaboration with major foundries such as TSMC, Samsung, SMIC, and others.
Our services encompass the entire chip development cycle-from design to production, including packaging and testing-enabling faster product innovation timelines for our global customers. Our key focus areas include high-performance computing, multimedia, automotive electronics, and AIoT applications. With a robust foundation of successful tape-outs and a highly skilled team, we have achieved significant milestones, including HBM3E, GDDR7/6X/6, UCIe Chiplet, and PCIe5, establishing a reputation for successfully delivering integrated solutions.
Innosilicon has supported over 300 top-tier clients, enabling the production of more than 10 billion high-end SoC chips. Our commitment is to drive global digital innovation by leveraging our expertise to accelerate chip development and improve the quality of life for all."

Why Choose Innosilicon for Your Chip Design Needs?
Why Choose Innosilicon for Your Chip Design Needs?
  • > Leading One Stop FinFet IP/ASIC Design House
    · 14nm/7/8nm/5nm/4nm/3nm design proven in Samsung/TSMC
  • > 10 Billion Leading SoC enabled
    · A trusted SoC vendor for AMD, Microsoft, Amason, Qualcomm
  • > 150K Finfet Wafers Produced in Custom ASIC
    · Custom ASIC in 14/10/8/5/3 advanced Nodes, with Samsung & TSMC
  • > Unique Technical Know How
    · Able to help major customers to port to various Advanced Processes
Global Offices
Global Offices
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