Process node supported
FinFET wafers mass-produced
High-end SoC mass-produced
Cooperative partners
GDDR6/6X,DDR5/LPDDR5/5X, DDR4(3,2)/LPDDR4(3,2),HBM2e/3, Chiplet Inter-Chip Interconnection
PCIe6/5/4,SATA3.0,Rapid IO, XAUI PHY,USB4,UFS, etc
HDMI2.1,eDP1.4,VBO, HiFi Audio Codec,MIPI
Full set of high-speed interface/integration IP: GPU/CPU/NPU/FPGA, etc.
Full set of high-performance IP solutions, one-stop worry-free integration
Optimal PPA based on the application scenarios, one-stop turnkey integration
10Gbps!The fastest LPDDR5/5X IP deliver production !
Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard2022-06
Innosilicon Brings High-end IPs to the DesignCon Global Conference2021-09
Join Innosilicon at TSMC 2021 Online Technology Symposium2021-05
Innosilicon IP helps Ingenic T20 win “China Chip” Excellent Market Performance2020-02
Industry Debut | Innosilicon’s Multiple High-Speed Interface IPs2020-02